Press-Fit Technology Blog: Engineering, Applications & Industry News

Press-fit technology continues to play a pivotal role in the evolution of electronic interconnects—providing reliable, solderless connections for high-density PCBs and automation-ready assembly lines. On this blog, we share technical perspectives, application insights, and market updates relevant to engineers, designers, and industry professionals working with press-fit and related technologies. Press fit connectors enable robust electrical connection without the need for soldering, making them ideal for high-performance, high-reliability environments.

On this blog, we share technical perspectives, application insights, and market updates relevant to engineers, designers, and industry professionals working with press-fit and related technologies. From compliance standards to emerging design practices, our editorial content is curated to inform and inspire those navigating the fast-moving world of electronics manufacturing. Explore the latest posts to stay informed and engaged with where press-fit technology is headed next.

Latest Articles on Press-Fit and Solderless Interconnects

Introducing New 0.4 mm Press-fit Pin

The all-new 0.4mm EON press-fit zone is designed to work with the now industry-standard plated-through-hole size of 0.60±0.05mm. The press-f

Implementing Press-fit Pin Installation Technology into Existing Automation Processes

Using solderless press-fit technology for on-board interconnects allows all SMT processes (solder paste screening, top & bottom side com

Electromechanical Termination of Shape Memory Alloy (SMA) Wire

Here we will discuss: 1) How crimping technology solves these challenges to provide highly reliable and repeatable assemblies in high-volume

Press-fit Technology: Creating Robust Solderless Interconnects

The Need for Automation-ready Solderless Interconnects Creating on-board interconnect solutions is an area of significant challenge for the implementation of lead-free soldering processes. One key area for high volume manufacturers is maintaining overall production efficiency. The secondary soldering processes that have been traditionally required for attaching large connectors and other specialized interconnects are very difficult to convert to lead-free processes. This is

Auto Splicing Machines: Autosplice’s Strategy Amid Market Abandonment

At Autosplice, our mission since 1954 has been to provide exceptional value to meet our customer requirements. Our success has largely been on the shoulders of the machine that generated our name, the SAS2 Splice Machine. We pioneered this technology and its products over 60 years ago and today we remain as the leading source of expertise for splicing components. Recently, one of the largest manufacturers in our industry has abandoned the splice market, deciding instead to p

Surface Mount Shield Clips: Cost‑Effective EMI & Grounding Solution

Surface mounted shield clips from Autosplice offer one of the most cost effective means to solve these noise problems. The surface mounted s

Solderball Pin™ Technology Streamlines Production and Conserves PCB Space for Multi-board Product Design

Automation-ready, discrete components offer design flexibility and facilitate SMT reflow while eliminating coplanarity issues. New connector designs leverage solderball pin technology to optimize board-to-board and specialized interconnect arrays. The growing use of multi-board modular product designs across a widening range of electronics applications is driving the need for advanced interconnect technologies that can deliver a high degree of design flexibility and solderin