Packaged in Tape Reel for use with standard feeders for automated placement. The product contains a Solderball that maintains its shape during multiple solder reflow processes. The PC board or device can then easily be soldered to pads on another parallel PC board. The Solderball pins accommodate up to .020" (0.5mm) coplanarity variation with high current reliability.
Solderball Pin™ Technology is engineered and widely used on POL (point of load) DC/DC Power applications when a PCB
mezzanine design is necessary due to real estate limitations, offering additional thermal dissipation capability via the robust
mechanical connection.
Compact configuration and flexibility as a discrete SMT component facilitates adoption into a broad scope of applications, including
electronic lighting controls, remote telemetry monitoring, ethernet, fibre channel, storage area networks, automotive, and many other
daughter-to-motherboard module-based subassemblies.