• PCB Connectors
  • Autoheader™ Technology
  • Custom Pin/Blade Headers
• RFI Shield Clips
• Shape Memory Alloy Actuators
• PCB Pins
• Solderball Pins
• Stamped Terminals
• Compliant/Press Fit
• Crimping Products
• Automation Equipment
  • Multisert^XS
  • Minisert^XE
  • Compact Mini^XB
  • MiniPin
  • Feeders

RoHS Compliance

Autosplice has the ability to provide our customers with RoHS Compliant "lead-free" plated products at your request. However, in order to provide a long-term reliable product with consideration to Tin Whisker mitigation, we must understand your end process requirements.

Autosplice Part Numbers that are "tin-lead" plated are not RoHS Compliant. All of our products are manufactured with various Copper Alloy base materials. Copper Alloys containing up to 4% "lead" content are listed as EXEMPT under Section 6 of the RoHS-WEEE Directive ANNEX (link below). In order to achieve RoHS Compliance, we must transition our products from traditional "tin-lead" plating to "lead-free".

At present, for products being manufactured within a high temperature "lead-free profile" requiring 1-2 reflows, we are recommending 80µin-120µin Nickel underplate with a finish plate of 160µin-240µin Matte Tin. This is the best known industry solution to guard against Tin Whisker growth with minimum reflow processing.

If the amount of reflows will exceed this level, we will increase the Tin plating to 200µin-300µin or 300µin-500µin dependent on solder process exposure specifications.

Please contact our Product Management group with your specific process details and requirements, and we will align our engineering documentation accordingly.