Solderball Pins

Elimina los Problemas de Coplanaridad a la Hora de Soldar PCB paralelos.

Componentes empacados en Carretes para utilizarlos con dispensadores estándar de colocación automática. El producto contiene una Bola de Soldadura que conserva su forma a lo largo de múltiples procesos de reflujo de soldadura. El PCB o dispositivo puede soldarse de manera sencilla a paneles o a otro PCB paralelo. Los pines Solderball se ajustan hasta variaciones de coplanaridad de 0,020'' (0,05mm), siendo confiable para corrientes elevadas.

+ Engineered for Form, Fit & Function

Midi Solderball Pin™
Mini Solderball Pin™

+ Design Guide

+ Features and Benefits

Automatic coplanarity compensation*: 0.020"
High current carrying capability*: 20 amp DC
Converts through hole device into SMT
Conducts heat from device to Host PCB

*Consult Factory for Specific Product Performance and Engineering characteristics

+ Mechanical Specifications

Pin terminal High Conductivity Copper alloy

Solder sphere RoHs Compliant SAC alloy or Tin/Lead

Packaging STD 16mm Tape & Reel per Spec EIA-481

Pick & Place Pin trough paste via standard SMT equipment

Configurations solderballpin@autosplice.com

+ Applications

Solderball Pin™ Technology is engineered and widely used on POL (point of load) DC/DC Power applications when a PCB mezzanine design is necessary due to real estate limitations, offering additional thermal dissipation capability via the robust mechanical connection.

Compact configuration and flexibility as a discrete SMT component facilitates adoption into a broad scope of applications, including electronic lighting controls, remote telemetry monitoring, ethernet, fibre channel, storage area networks, automotive, and many other daughter-to-motherboard module-based subassemblies.