Solderball Pin™ Technology is engineered and widely used on POL
(point of load) DC/DC Power applications when a PCB
mezzanine design is necessary due to real estate limitations,
offering additional thermal dissipation capability via the robust
mechanical connection.
Compact configuration and flexibility as a discrete SMT component
facilitates adoption into a broad scope of applications, including
electronic lighting controls, remote telemetry monitoring,
ethernet, fibre channel, storage area networks, automotive, and many
other
daughter-to-motherboard module-based subassemblies.