Press Releases

08-28-2012 +Autosplice Enhances Solderball Pin™ Technology






FOR IMMEDIATE RELEASE

Autosplice Enhances Solderball Pin™ Technology By Offering New
Applications-Engineered Solutions

New Solderball Pin Arrays™ Provide Automatic Coplanarity Compensation, Conserve
PCB Real Estate, Reduce Board-to-Board Spacing and Streamline Assembly

San Diego, CA August 28, 2012 Autosplice has introduced a new series of specialized Solderball Pin Array™ (SPA) interconnect capabilities that leverage the company’s industry-leading Solderball Pin™ Technology by creating pre-defined arrays and header configurations that are targeted to meet application-specific requirements.

These new Solderball Pin Array solutions are extensions of the existing family of proven discrete component Solderball Pin configurations, which have already been adopted for a wide range of motherboard-daughterboard product designs in the power module, communications, automotive, mobile device and many other industries. With Solderball Pin Arrays, customers can benefit by having many solderball interconnects in one component that meets their specific circuit pattern and streamlines assembly processes.

Solderball Pin Arrays group together multiple solderball interconnects within a single automation friendly format, such as a strip header that provides a series of contact points in a single piece. Configurations can be either in-line or staggered, with virtually any specified pitch between interconnects and a variety of stand-off lengths for inter-PCB spacing. Solderball Pin Arrays also support either SMT-to-Through-Hole or SMT-to-SMT processes. In addition to header strips, Solderball Pin Arrays also can be custom tailored to special configurations such as rings, lead frames or other application specific requirements.

The primary advantages of both Solderball Pins and the new Solderball Pin Arrays include:

  • Automatic coplanarity compensation between PCBs as the module settles on to the motherboard during reflow
  • Smoothly transitioning through-hole designs to SMT without extensive redesign
  • Higher reliability, lower cost and less space needed than with conventional male-female separable connectors
  • Conserving PCB real estate, reducing number of PCB routing layers and minimizing electrical trace lengths
  • Reducing space between boards for more compact designs, while still maintaining optimal airflow and thermal characteristics
  • Automation-friendly placement and compatibility with standard reflow processes

According to Clive Miller, Senior Product Manager, “The new Solderball Pin™ Array offerings provide another valuable option for manufacturers who need to tailor all of the advantages of Solderball Pin Technology to their specific requirements while minimizing the number of placement steps, and using single components to create multiple solder connections between parallel PCBs.”

Download a copy of Autosplice's latest white paper on Using Solderball Pin Array™ (SPA) technology by clicking here www.autosplice.com or on the link under the Resources section to the right.

All standard products in the Solderball Pin family are available in stock through Autosplice’s ongoing relationships with leading distributors, including Heilind and Kensington.

About Autosplice

Autosplice is a multi-national, custom electronic interconnect solutions provider for the global Industrial, Consumer, Transportation, Medical, Automotive, and Telecom markets. The company's diverse and engineered solutions oriented product portfolio includes connectors, precision metal pins & stampings, continuous molded interconnects, integrated connector modules, shape memory alloy assemblies, printed circuit board assemblies and insertion equipment. Headquartered in San Diego, CA, Autosplice operates in nine countries around the world; USA, Mexico, Brazil, UK, Germany, Japan, Korea, Singapore, and China.

 For More Information

Autosplice contact: Clive Miller 858-535-0077, Email CMiller@autosplice.com

For more information on Autosplice’s products or to discuss unique applications, contact Autosplice at (800) 535-5538 or visit our Web Site at www.autosplice.com

Photos, press releases and other resources to aid in publication of Autosplice news can be downloaded at www.sitmark.com/autosplice

04-17-2013 +Autosplice Introduces New Antenna Contact Technology




FOR IMMEDIATE RELEASE

Autosplice Introduces New Antenna Contact Technology

Compact One-Piece Contacts Optimized for Applications in Mobile Wireless Devices

San Diego, CA April 17, 2013  Autosplice has introduced a new series of compact surface mount contacts for antenna applications in mobile devices such as smartphones and tablets.

The new single-piece contact designs are ideally suited for Near Field Communications (NFC) Antenna requirements as well as other grounding applications within wireless communications designs and are superior to existing two-piece molded products.

Typical existing antenna clips use multi-piece configurations that are manufactured through the assembly of the antenna contact terminal to an injection molded base, with separate fixing pins to support the SMD interface. This approach increases complexity and quality risk, as well as increasing manufacturing costs.

In contrast, the new Autosplice crush-proof antenna clips integrate both the antenna contact and the base into a unified single-piece stamping that improves reliability and reduces cost. Since the entire contact is formed from stamped copper alloy, contact resistance and mechanical stability during vibration are superior to multi-piece designs. In addition, the footprint of the one-piece contacts can be significantly smaller, requiring less PCB space and allowing for overall better fit, form and function.

Autosplice antenna clip products are manufactured from stamped copper alloy material and are available in standard 13” tape and reel for ease of pick and place assembly. The clips are also available in a variety of heights to accommodate specific antenna and product design requirements while minimizing PCB real estate usage.

NFC is a form of contactless communication between devices like smartphones or tablets, which enables a user to wave the smartphone over an NFC compatible device to send information without needing to touch the devices together or go through multiple steps setting up a connection. Fast and convenient, NFC technology is popular in many parts of Europe and Asia, and is quickly spreading throughout the United States. By integrating credit cards, subway tickets, and paper coupons all into one device, NFC enables a user to board a train, pay for groceries, redeem coupons or loyalty points, and exchange contact information all with the wave of a smartphone.

One of the major challenges for integrating NFC into a product is making sure that the antenna will meet the requirements of NFC standards, such as ISO 14443B and NFC-Forum Type 4 tag compliance. Successful integration depends on precision control of the size, shape, material and positioning of the antenna, along with the need for robust resistance to vibration and shock under a wide range of operating conditions. NFC antenna designers need access to contacts such as the new single-piece Autosplice design that can provide maximum configuration flexibility and reliability while also minimizing cost and size.

The new single-piece antenna clip designs from Autosplice are already being used in leading mobile devices that account for over 300 million contacts per month and are currently being designed into many more NFC-enabled devices because of the inherent cost advantages and manufacturing efficiencies.

All standard products are also available through Autosplice’s ongoing relationships with leading distributors, including Heilind and Kensington.

About Autosplice

Autosplice is a multi-national, custom electronic interconnect solutions provider for the global Industrial, Consumer, Transportation, Medical, Automotive, and Telecom markets. The company's diverse and engineered solutions oriented product portfolio includes connectors, precision metal pins & stampings, continuous molded interconnects, integrated connector modules, shape memory alloy assemblies, printed circuit board assemblies and insertion equipment. Headquartered in San Diego, CA, Autosplice operates in nine countries around the world; USA, Mexico, Brazil, UK, Germany, Japan, Korea, Singapore, and China.

For More Information

Autosplice contact: Clive Miller, Senior Product Manager, at 858-535-0077 or email CMiller@autosplice.com

For more information on Autosplice’s products or to discuss unique applications, contact Autosplice at (800) 535-5538 or visit our Web Site at www.autosplice.com

Photos, press releases and other resources to aid in publication of Autosplice news can be downloaded at www.sitmark.com/autosplice